CAS: 47073-92-7
Molecular Formula: C16H12N2O2
Molecular Weight:264.28
Synonyms: ethylidene bis-4,1-phenylene dicyanate; 1,1-Bis(4-cyatophenyl)ethane; cyanic acid ethylidenedi-4,1-phenylene ester; Bisphenol E cyanate ester
1,1-Bis(4-cyanatophenyl)ethane CAS 47073-92-7
CAS 47073-92-7 is 1,1-Bis(4-cyanatophenyl)ethane , also known as Bisphenol E cyanate ester. It is a high-performance monomer in the family of cyanate ester resins, which is a room-temperature liquid with low viscosity.
Specification
| CAS | 47073-92-7 |
| Appearance | Liquid |
| Boiling point | Approximately 383℃ |
| Storage conditions | It is recommended to store at 2–8℃. |
Application
Electronic materials: 1,1-Bis(4-cyanatophenyl)ethane, CAS 47073-92-7, is used for high-frequency and high-speed copper clad boards, RF substrates, chip bottom fill, liquid packaging, and insulation for high-power devices.
Composite materials: Lightweight structures, antennas, wind turbine blades, sports equipment.
Adhesives and encapsulation: High-temperature structural adhesives, electronic encapsulation materials, semiconductor packaging.
Modifiers: 1,1-Bis(4-cyanatophenyl)ethane, CAS 47073-92-7, is used as a reactive diluent and toughening agent for epoxy resins and bis-maleimide (BMI).
Features
Room temperature liquid, low viscosity: Can be used without heating, compatible with RTM, VARTM, winding, pultrusion, potting and other liquid molding processes.
Good heat resistance of the cured product: Tg is approximately 220–240℃, with excellent thermal stability.
Low dielectric constant, low loss: Dielectric constant (Dk) is approximately 2.9–3.1, with low dielectric loss (Df), suitable for high-frequency electronic applications.
Low water absorption rate, dimensional stability: Resistant to wet heat aging, suitable for high-reliability electronic and structural components.
Processing-friendly: The curing heat release is gentle, the shrinkage is small, it can be cured alone or mixed with epoxy, BMI, etc. for modification.
Packaging
25kg/drum.












