CAS: 901-44-0
Molecular Formula: C19H24O4
Molecular Weight: 316.39
EINECS: 227-062-3
Synonyms: 2,2’-[(1-methylethylidene)bis(4,1-phenyleneoxy)]bis-ethano; 2,2’-[(1-methylethylidene)bis(4,1-phenyleneoxy)]bis-Ethanol; 2,2’-[Isopropylidenebis(p-phenyleneoxy)]diethanol; 4,4′-bis-(Hydroxyethoxy)diphenyldimethylmethane; Ethanol,2,2’-[(1-methylethylidene)bis(4,1-phenyleneoxy)]bis-
4,4′-ISOPROPYLIDENEBIS(2-PHENOXYETHANOL) CAS 901-44-0
4,4′-ISOPROPYLIDENEBIS(2-PHENOXYETHANOL) CAS 901-44-0: White solid, high boiling point, low volatility. Mainly used in the synthesis of epoxy resins / polyurethanes / polyesters, for toughening, heat resistance, and water resistance.
CAS: 901-44-0
Appearance: White crystalline powder
Purity: Industrial grade ≥ 97%; Analytical grade ≥ 99%
Specification
| Item | Specification |
| CAS | 901-44-0 |
| Appearance | Liquid |
| Melting point | 112℃ |
| Flash point | 253℃ |
Application
Epoxy resin: 4,4′-isopropylidene bis(2-phenoxyethanol) modified monomer / curing agent, enhancing toughness, heat resistance, moisture resistance, and adhesion
Polyurethane (PU): Diol chain extender, used in elastomers, adhesives, sealants, with high resilience, water resistance
Saturated polyester / alkyd resin: Copolymer monomer, increasing Tg, hardness, and weather resistance
Coatings / inks: High boiling point solvents / toughening agents, improving film formation and flexibility
Electronics / copper clad laminate: 4,4′-isopropylidene bis(2-phenoxyethanol) heat-resistant epoxy monomer, suitable for lead-free soldering materials
Packaging
25kg/drum, Moisture-proof sealed packaging to prevent moisture absorption
Storage
Temperature: Store at room temperature in a cool place (10–30℃), away from heat sources / open flames / direct sunlight
Environment: Store in a dry and well-ventilated warehouse, with relative humidity < 60%
Stacking: Keep at least 10cm away from the ground and walls, and avoid heavy pressure (to prevent caking)
Sealing: After opening, it must be sealed to prevent moisture absorption and oxidation
