4,4'-Methylenebis(2,6-dimethylphenylcyanate) CAS 101657-77-6

4,4′-Methylenebis(2,6-dimethylphenylcyanate) CAS 101657-77-6

CAS: 101657-77-6
Molecular Formula: C₁₉H₁₈N₂O₂
Molecular Weight：306.36
Synonyms: Cyanic acid methylenebis(2,6-dimethyl-4,1-phenylene) ester; tetramethyl bisphenol f cyanate ester; METHYLENEBIS(2,6-DIMETHYL-4,1-PHENYLENE)ESTEROFCYANICA.; CYANICACID,METHYLENEBIS(2,6-DIMETHYL-4,1-PHENYLENE)EST.

4,4′-Methylenebis(2,6-dimethylphenylcyanate) CAS 101657-77-6

4,4′-Methylenebis(2,6-dimethylphenylcyanate) with CAS number 101657-77-6 is a highly performing monomer of bisphenol F type cyanate ester resin. Off-white to white crystalline powder. The dielectric constant (Dk) and dielectric loss (Df) are both at low levels, making it suitable for high-frequency and high-speed signal transmission.

Specification

CAS	101657-77-6
Form	Powder
Density	1.14
Flash point	162°C

Application

High-frequency and high-speed electronics: 5G/6G communication PCBs, RF (Radio Frequency) substrates, server/AI hardware circuit boards, ensuring low loss and high signal integrity.
Lightweight structural composite materials, taking into account high temperature resistance, low dielectric constant and lightweight.
High-performance packaging and composite materials: Chip packaging materials, high-power device insulating parts, replacing some epoxy resins and ordinary cyanoacrylates to enhance reliability.

Features

Excellent heat resistance: The glass transition temperature (Tg) after curing is > 250℃, the thermal decomposition temperature (Td) is > 450℃, and the long-term high-temperature stability is excellent.
Resistance to humidity and temperature stability: The water absorption rate is extremely low, the resistance to humidity aging is strong, and the size and performance drift is small in a high-humidity environment.
Balance of rigidity and toughness: The cured product has high mechanical strength, good impact resistance and bending resistance, and is suitable for high-reliability structural components.
Processing compatibility: The melting point is moderate, the melt viscosity is low, the curing heat release is gentle, and it is suitable for lamination, encapsulation, injection molding and other processes.