CAS: 135507-71-0
Molecular Formula: C₂₄H₂₂N₂O₂
Molecular Weight：370.45
Synonyms: dicyclopentadienylbisphenol cyanate ester; Dicyclopentadienyl bisphenol cyanate ester solution
Dicyclopentadienylbisphenol Cyanate Ester DCPD CAS 135507-71-0
CAS 135507-71-0 is a dicyclopentadienylbisphenol cyanate ester, commonly known as polydicyclopentadienyl bisphenol cyanate, and it is a high-performance thermosetting cyanate ester monomer.
Specification
| CAS | 135507-71-0 |
| Form | Liquid |
| MF | C₂₄H₂₂N₂O₂ |
| MW | 370.45 |
Application
High-frequency high-speed copper-clad board / packaging substrate: 5G/6G communication base stations, servers, high-speed routers, high-end PCBs.
Electronic packaging: Dicyclopentadienylbisphenol Cyanate Ester DCPD is used for chip bottom filling, high-power device packaging, and semiconductor plastic encapsulation materials.
High-performance composite materials: Replace epoxy / bis-maleimide, used for lightweight and high-temperature structural components.
Features
Low dielectric constant / low loss: The dielectric constant (Dk) is approximately 2.8–3.0, and the dielectric loss (Df) is extremely low, far superior to epoxy, making it suitable for high-frequency and high-speed signal transmission.
Excellent heat resistance: The glass transition temperature (Tg) is high, the thermal decomposition temperature is high, and the long-term usage temperature stability is good.
Low water absorption: The water absorption rate is extremely low, the dimensional stability is excellent, and it is suitable for high-humidity and high-reliability environments.
Mechanical and weather resistance: The balance of rigidity and toughness is good, resistant to chemical corrosion, and resistant to wet heat aging.
Processing-friendly: Low viscosity, gentle heat release during curing, small curing shrinkage, suitable for lamination, injection molding, and encapsulation.
Packaging
25kg/drum.
