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CAS NO.:1156-51-0
Formula molecolare:C17H14N2O2
Peso Molecolare:278.31
EINECS:214-590-4
Sinonimi:Cyanicacid, (1-metiletiliden)di-4, 1-phenyleneester; propano,2,2-bis(4-cyanatophenyl)-
What is 2,2-Bis-(4-cyanatophenyl)propane with CAS 1156-51-0?
2,2-Bis-(4-cyanatophenyl)propane (CAS 1156-51-0), also known as Bisphenol A cyanate ester, is a high-performance thermosetting resin monomer widely used in advanced composite materials and electronic encapsulation. It features excellent thermal stability, low dielectric constant, and superior mechanical strength, making it a key material in aerospace, electronics, and high-performance composites.
As a difunctional cyanate ester derived from Bisphenol A, it undergoes cyclotrimerization reactions to form triazine ring networks, resulting in highly crosslinked structures with outstanding thermal and dielectric properties.
Specifica
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Nome del prodotto
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2,2-Bis-(4-cyanatophenyl)propano
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Cas
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1156-51-0
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Aspetto
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Polvere bianca
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Dosaggio
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99%
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Applicazione
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intermedi organici
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MOQ
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1kg
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Consegna veloce
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1-5days
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Termini di pagamento
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T/T;L/C;Money Gram;Scambi di assicurazione di ordine
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Punto di fusione
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80 °C
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Punto di ebollizione
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391.0±52.0 °C(Previsto)
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densità
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1.171±0.06 g/cm3(Previsto)
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temperatura di conservazione.
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Sigillati in luogo asciutto,Temperatura ambiente
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Applicazione
1. Advanced Composite Materials
Bisphenol A cyanate ester (CAS 1156-51-0) is widely used in carbon fiber composites, glass fiber composites, and aerospace-grade laminates. Its crosslinked triazine structure provides:
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High glass transition temperature (Tg > 250°C)
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Excellent dimensional stability
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Low moisture absorption
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Superior adhesion to reinforcing fibers
These properties make it ideal for aerospace structures, satellite components, and high-performance automotive composites.
2. Electronic and Electrical Applications
Owing to its low dielectric constant and excellent thermal endurance, 2,2-Bis-(4-cyanatophenyl)propane is a key material in:
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Printed circuit boards (PCBs)
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Semiconductor encapsulation resins
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High-frequency electronic substrates
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Adhesive formulations for electronic packaging
Its low outgassing and minimal dielectric loss ensure stability in microelectronic and communication equipment.
3. Adhesives and Coatings
The reactive cyanate ester groups enable self-polymerization or copolymerization with epoxy or bismaleimide resins. This improves:
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Crosslink density and mechanical strength
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Chemical and solvent resistance
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Long-term heat resistance
Therefore, it’s often used in heat-resistant coatings, adhesive systems, and structural composites requiring durability under extreme environments.
Imballaggio
25kgs/drum, 9tons/20'container
