CAS: 90-72-2
Molecular Formula: C15H27N3O
Molecular Weight: 265.39
EINECS: 202-013-9
Synonym: Tris(dimethylaminomethyl)phenol,2,4,6-; 2,4,6-TRI(DIMETHYLAMINOETHYL)PHENOL; a,a’,a”-Tris(dimethylamino)mesitol; ProChemicalbooktexNX3; TAP(aminophenol); VersamineEH30; Tris-(dimethylaminemethyl)phenol; 2,4,6-TRIS(DIMETHYLAMINO-METHYL)PHENOLPRACT.
Tris(dimethylaminomethyl)phenol CAS 90-72-2 is colorless or light yellow transparent liquid. Purity is more than 96%, with ammonia odor. Insoluble in cold water, slightly soluble in hot water, soluble in alcohol, benzene, acetone.
Tris(dimethylaminomethyl)phenol (CAS 90-72-2), commonly known as DMP-30, is a tertiary amine compound widely used as a curing accelerator and catalyst in epoxy resin systems, polyurethane coatings, and other thermosetting materials.
Due to its excellent catalytic activity and compatibility, DMP-30 is a popular choice for industrial applications requiring fast curing, high mechanical strength, and chemical resistance. It provides consistent curing even under low-temperature or high-humidity conditions.
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Element
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Spezifikationen
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Aussehen
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Licht gelb bis rot Braun transparent Viskose Flüssigkeit
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Reinheit
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95% min
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Water %
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0.5% max
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Viskosität (MPA S/20 ° C)
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120-250
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Tris(dimethylaminomethyl)phenol is one of the most effective epoxy resin accelerators.
It promotes fast and complete curing of epoxy systems when used with polyamide or anhydride curing agents.
Improves hardness, adhesion, and chemical resistance of cured products.
Commonly used in electrical encapsulation, adhesives, and coatings.
When combined with anhydride hardeners, it significantly shortens curing time and enhances the final product’s heat resistance.
As a tertiary amine, DMP-30 serves as an efficient catalyst for polyurethane foams and coatings.
Accelerates polymerization of isocyanate and polyol.
Provides balanced reactivity for uniform foam structure.
Used in rigid and flexible foam formulations, elastomers, and coatings.
DMP-30 enhances bonding performance in epoxy adhesives used for metal, glass, and composite materials.
It improves curing efficiency at room temperature and ensures a strong, durable bond with minimal shrinkage.
In electronic encapsulation resins and composite materials, Tris dimethylaminomethyl phenol provides:
High thermal stability
Enhanced dielectric strength
Excellent chemical resistance
It ensures consistent quality in precision electronic potting and composite component production.
As a professional DMP-30 manufacturer and Tris(dimethylaminomethyl)phenol supplier, we provide:
High-purity products with consistent performance.
Factory-direct prices and global logistics support.
Technical guidance for epoxy and polyurethane formulations.
Customized grades according to different curing systems and applications.
Our commitment to quality and stability has made us one of the trusted Tris(dimethylaminomethyl)phenol suppliers worldwide.
200kgs/Trommel, 16tons/20'container
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